- February 17, 2022
The project planned for me was extremely well organized and I got to contribute a lot of my own ideas. I was welcomed as part of the team and attended all meetings as if I were an employee.
Several things I did during my internship in the Track Systems Division:
-Determined cause of temperature non-uniformity during cooling in wafer manufacturing devices and developed a countermeasure
-Developed temperature output model to improve real temperatures inside bake unit
-Improved temperature uniformity during wafer processing